| 引用本文: | 齐晓琳，崔晶宇，李 霄，张先乐，彭轶瑶，戴 扬，杨 凝. 晶圆级树脂基低成本W波段封装天线微系统[J]. 雷达科学与技术, 2024, 22(1): 29-34.[点击复制] |
| QI Xiaolin, CUI Jingyu, LI Xiao, ZHANG Xianle, PENG Yiyao, DAI Yang, YANG Ning. Low⁃Cost W⁃Band Antenna⁃in⁃Package Microsystem Based on Wafer Level Packaging with Resin Material[J]. Radar Science and Technology, 2024, 22(1): 29-34.[点击复制] |
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| 摘要: |
| 面向W波段探测与通信系统的小型化、低成本应用需求，本文采用晶圆级树脂基扇出型封装工艺，通过对有源封装天线集成架构、互连传输结构和天线阵列进行设计与仿真，设计了一款工作频率为94 GHz的封装天线微系统。该封装天线微系统集成了4×4磁电偶极子阵列天线和16通道幅相多功能射频芯片。通过Ansys HFSS全波仿真，系统波束扫描范围在E面≥±30°，H面≥±40°，在7.1 mm×8.3 mm×1.2 mm封装尺寸内实现了封装天线等效全向辐射功率≥39.1 dBm。该封装天线微系统具备规模扩展能力，可广泛应用于探测、通信以及安检等领域。 |
| 关键词: W波段 封装天线 低成本 树脂材料 晶圆级封装 |
| DOI：DOI:10.3969/j.issn.1672-2337.2024.01.005 |
| 分类号:TN821+.8 |
| 基金项目: |
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| Low⁃Cost W⁃Band Antenna⁃in⁃Package Microsystem Based on Wafer Level Packaging with Resin Material |
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QI Xiaolin, CUI Jingyu, LI Xiao, ZHANG Xianle, PENG Yiyao, DAI Yang, YANG Ning
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Information Science Academy, China Electronics Technology Group Corporation, Beijing 100049, China
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| Abstract: |
| Due to the miniaturization and low?cost requirements of W?band radar detection and wireless communication systems, an antenna?in?package （AiP） microsystem working at 94 GHz is designed. In this article, the integration architecture, the high?frequency interconnection network, and the antenna array of the active AiP are designed and simulated based on the fan?out wafer level packaging （FOWLP） with resin material. The AiP microsystem integrates a 4×4 magnetoelectric dipole antenna array and a 16?channel amplitude?phase multifunctional RF chip. Simulated by the Ansys HFSS, an beam scanning range over ±30° in the E?plane and ±40° in the H?plane can be obtained. The effective isotropic radiated power （EIRP） is above 39.1 dBm within a footprint less than 7.1 mm×8.3 mm×1.2 mm. The AiP microsystem is scalable and suitable for detection, communication, and security checking applications. |
| Key words: W⁃band antenna⁃in⁃package（AiP） low⁃cost resin material wafer level packaging （WLP） |
