| 摘要: |
| 针对相控阵雷达向多功能射频感知微系统方向发展的需求，要求设备物理层面向高集成、微小型、共形方向发展，功能层面向大带宽、多功能、多极化、多模式工作方向发展。基于此，本文采用多通道高密度混合集成架构设计技术，低成本异构多功能芯片设计技术，射频信号在多维度、多介质中立体传输阻抗匹配优化设计等关键技术，设计出一款基于系统级封装（Sip）的多通道、宽频段、全极化、高功率T/R组件。并通过引入控制理论中传递函数的思想，提出一种高密度集成多场耦合稳健优化设计方法，可有效地解决多物理场下T/R组件稳定性问题，减少实物迭代次数，提高设计效率。经测试验证，组件幅相等指标一致性好，能很好地满足新型板级多功能雷达的工作需要。 |
| 关键词: 系统级封装（Sip） 宽频段 高功率 多极化 T/R组件 |
| DOI：DOI:10.3969/j.issn.1672-2337.2026.02.005 |
| 分类号:TN957 |
| 基金项目:科技部国家重点研发计划（2020YFA0709704） |
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| Design of High-Power Wideband Full-Polarization T/R Module Based on Sip |
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LIANG Zhangang， LIU Falin， LIU Zhihong， LI Hanwen， CHEN Xingguo
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1. Department of Electronic Engineering and Information Science,University of Science and Technology of China, Hefei 230026, China;2. The 38th Research Institute of China Electronics Technology Group Corporation, Hefei 230088, China
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| Abstract: |
| To address the development requirements of phased array radar toward multifunctional radio frenquency （RF） sensing microsystems, the physical layer of equipment must advance in high integration, miniaturization and conformality, while its functionality should evolve toward wide bandwidth, multifunction, multi-polarization and multi-mode operation. Building on this, this paper leverages multi-channel high-density hybrid heterogeneous integration architecture design and critical technologies such as 3D impedance matching for RF signal transmission across multi-dimensional and multi-medium environments, this study designs a Sip-packaged T/R module featuring multi-channel operation, wideband coverage, full-polarization agility and high-power capacity. By introducing a transfer function methodology, a robust optimization design approach for high-density integrated multi-physics coupling is proposed, effectively resolving stability challenges in T/R modules under multi-physical fields while enhancing design efficiency. Experimental validation confirms excellent amplitude-phase consistency across channels, demonstrating the module’s capability to meet operational requirements of next-generation board-level multifunctional RF array microsystems. |
| Key words: Sip wideband high power full-polarization T/R module |
